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Breakthrough in Nano‑Microporous Insulation Board R&D: Ultra‑Thin Panels Deliver Super‑Low Thermal Conductivity
2026-08-31
Author:
Langfang Xitu
A research team has achieved key technical breakthroughs for nano‑microporous insulation boards. Compared with conventional products, the new material reaches ultra‑low thermal conductivity with thinner thickness, combining light weight, high‑temperature resistance and non‑toxic eco‑friendly features. Suitable for residential energy‑saving construction as well as thermal protection for industrial high‑temperature pipelines and equipment, the innovative product reduces material thickness, transport and installation costs, offering a new domestic alternative for high‑end thermal‑insulation applications.
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